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· 适用高像素视觉方式以高精度贴装IC元器件 · 能利用Polygon功能简单登记形状复杂的元器件
产品特征
可靠性
使用了强大的Camera算法
通过元器件的影像噪音消音功能、自动示教功能提高识别精度 实时自动补偿Chip、TR、BGA、QFP之类的元器件吸取位置
操作简单
Polygon识别算法
提取元器件的形态后识别整整体形态,可以简单登记形状复杂的元器件
操作简单
Multi-Vendor元器件管理功能
通过不同的供料器供应同一元器件时,不必更改PCB文件也不必重新下载就能使用。
规格参数
Machine Name | SM471PLUS | SM481PLUS | SM482PLUS | ||
Alignment | Fly Camera | Fly Camera | Fly Camera | ||
+ Fix Camera (Option) | + Fix Camera | ||||
The Number of Spindles | 10 Spindes x 2 Gantry | 10 Spindle x 1 Gantry | 6 Spindle x 1 Gantry | ||
Placement Speed | 78,000CPH (Optimum) | 40,000 CPH (Optimum) | 30,000 CPH (Optimum) | ||
Placement Accuracy | Chip | ±40μm@±3σ | |||
QFP | ±50μm@±3σ | ±30μm@±3σ | |||
Component Range | *Fly Camera | Chip IC,Connector BGA, CSP | 0402 ~ □14mm | 0402 ~ □16mm | 0603 ~ □22mm (*** 0402 ~ □14mm) |
*Fix Camera | IC, Connector BGA, CSP | - | □16mm ~□42mm (Standard) □42mm ~□55mm (MFOV) L55mm ~ L75mm Connector (MFOV) | ||
Max. Height | 12 mm | 10 mm (Fly) | 12 mm (Fly) | ||
15 mm (Fix) | 15 mm (Fix) | ||||
PCB Size (mm) | Min. | L50 x W40 | |||
Max. | Single Lane | ~ L510 x W460 | ~ L460 x W400 | ~ L460 x W400 | |
~ L610 x W460 (Option) | ~ L510 x W460 (Option) | ~ L510 x W460 (Option) | |||
~ L610 x W510 (Option) | ~ L610 x W510 (Option) | ||||
~ Max. L1,500 x W460 (Option) | ~ Max. L1,200 x W510 (Option) | ||||
Dual Lane | ~ L460 x W250 ~ L610 x W250 (Option) | - | - | ||
PCB Thickness | 0.38 ~ 4.2 | ||||
Feeder Capacity (8mm standard) | 120ea/112ea (Docking Cart) | ||||
Utility | power | AC200 / 208 / 220 / 240 / 380 / 415V (50/60Hz, 3Phase) | |||
Max. 5.0kVA | Max. 3.5kVA | Max. 3.5kVA | |||
Air Consumption | 0.5 ~ 0.7MPa (5.0 ~ 7.0kgf/cm2) | ||||
350Nℓ/min | 160Nℓ/min | 180Nℓ/min | |||
50Nℓ/min (Vacuum Pump) | 50Nℓ/min (Vacuum Pump) | 50Nℓ/min (Vacuum Pump) | |||
Mass (kg) | Approx. 1,730 | Approx. 1,655 | Approx. 1,575 | ||
External Dimension (mm) | L1,650 x D1,690 x H1,485 | L1,650 x D1,680 x H1,530 | L1,650 x D1,680 x H1,530 |
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